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ThinkSystem SR850

The ThinkSystem SR850 integrates 4 channels of Xeon 112 cores, 6 TB of memory, 24 NVMe disk slots, 10 PCIe expansion, and platinum level redundant power supply in a 2U rack, providing a high-density, highly reliable domestic alternative and universal computing platform for databases, memory computing, virtualization integration, and critical businesses

    product detail

    Form: 2U rack mounted, with a chassis depth of 782mm, supporting standard 19 inch cabinet slide rail installation; Fully modular and tool free maintenance design. computing platform CPU: 4 second-generation Intel Xeon Scalable (Cascade Lake SP), available in Bronze 3106 to Platinum 8280, with a maximum of 112 cores and 224 threads, and a maximum TDP of 205 W. ? Memory: 48 x DDR4-2933 DIMM, maximum 6 TB (128 GB LRDIMM x 48), supports Intel Optane PMem 200 series, and increases memory bandwidth by 60%. Storage and I/O ? Disk position: - Front end 24 × 2.5 "(including 8 × NVMe U.2 support) or 12 × 3.5" hot swappable; - Rear 2 × 2.5 "hot swappable; - Internal 2xM.2 SATA/NVMe (RAID 1 system disk). RAID: onboard 8 x SATA soft RAID 0/1/5/10; Optional hard RAID cards such as 730-8i/930-16i/940-16i, with 2-4 GB of cache and support for RAID 50/60. PCIe: Up to 9 x PCIe 3.0 (including 1 x OCP 3.0), compatible with high-speed network cards, FC HBAs, GPUs, or FPGA expansion cards. Network and Management ? Network: onboard 2 × 10 GbE SFP+or 2 × 1 GbE RJ-45; OCP 3.0 supports 25/40/100 GbE and FC HBA. ? Management: Integrated XClarity Controller BMC+XClarity Administrator, supporting Redfish, KVM over IP, firmware batch upgrade, and cloud energy consumption monitoring. Power supply and heat dissipation ? Power supply: 750 W/1100 W/1600 W 80 PLUS Platinum/Titanium Hot swappable Redundant Power Supply; Supports 240V DC. ? Heat dissipation: Partition fan wall, N+1 redundancy, supports long-term operation at 35-40 ° C, high-density deployment at cabinet level without hotspots.